A PARTNER FOR YOUR PVD JOURNEY

PVD Solutions From Wafer-Level to Panel-Level Advanced Packaging

FAB TOOLS
Production systems for wafer- and panel-level advanced packaging
P-600-RFOPLP

FOPLP Sputtering Thin-Film Deposition System

Fan-Out Panel-Level Packaging

Fully Integrated Cluster Platform: Seamlessly combines Degas, CCP Pre-Clean, and PVD processes for high-yield Fan-Out Panel-Level Packaging (FOPLP).

Integrated degas, pre-clean, and PVD process on a single platform
Large-area planar PVD target design — low particle contamination, low cost of ownership, high target utilization
Dual-frequency capacitively coupled plasma (CCP) etch technology for low contact resistance
Compatible with PI, ABF, and EMC substrate materials
Supports double-sided thin-film deposition
Panel-levelDegas + pre-clean + PVDDouble-sided
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P-300-RSFOWLP

FOWLP Sputtering Thin-Film Deposition System

Fan-Out Wafer-Level Packaging

Integrated degas, etch, and PVD process functions engineered for precise RDL seed-layer formation at wafer level.

Integrated degas, etch, and PVD process functions
Proprietary magnetron design and target power configuration for higher metal ionization
Built-in intelligent software algorithms for precise sputtering process control
Precise full-wafer film thickness control, laying the foundation for RDL layers
Low-resistance, high-adhesion metal seed layers that improve downstream plating yield
Wafer-levelRDL seed layerHigh ionization
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D-600Plasma Descum

Plasma Descum System

Organic residue removal & deep-via etching

A remote plasma descum system tuned for uniform etching across a wide range of organic packaging materials.

Descum processing for a wide range of organic materials
Industry-leading etch uniformity
Unique plasma design (remote plasma generation + RF bias) to tune ion bombardment for deep-via etching
Innovative gas flow distribution design for highly uniform surface plasma
Remote plasma configuration reduces ion-bombardment surface damage
Remote plasmaDeep-via etchHigh uniformity
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P-600-TTGV

Sputtering Thin-Film Deposition System

TGV (Through-Glass Via) Applications

A high deposition-rate sputtering system built for large-format TGV substrates and high-aspect-ratio via metallization.

High deposition rate sputtering system for large-format TGV substrates
Large-area planar PVD target design with high target utilization
High-ionization target sputtering technology for excellent step coverage
Patented electromagnetic field design for low film resistivity and strong adhesion
Patented cooling system design for low process temperature
Double-sided sputtering with vacuum flip mechanism
System configuration customizable to throughput requirements
510 × 515 mm15:1 aspect ratioDouble-sided
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P-300-TTSV

Sputtering Thin-Film Deposition System

TSV (Through-Silicon Via) Applications

Integrated degas, etch, and PVD process functions engineered for deep-via metal ion penetration at wafer scale.

Integrated degas, etch, and PVD process functions
Proprietary magnetron design and target power configuration for higher metal ionization
Built-in intelligent software algorithms for precise sputtering process control
Special electromagnetic coil design significantly increases metal ion penetration into deep vias
High step coverage and high production efficiency
Deep-via fillHigh step coverageIntegrated etch
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LAB TOOLS
Research platforms for thin-film development and materials discovery
PLDPulsed Laser Deposition

Pulsed Laser Deposition System

Epitaxial thin-film growth for oxides, nitrides & ceramics

An ultra-high-vacuum PLD platform combining resistive and laser heating for precision epitaxial thin-film research.

Ultra-high vacuum system
Dual-mode heating: resistive and laser heating, with precise temperature control from room temperature to 1100°C
Fully automated, servo-driven motion for high experimental reproducibility
Optional laser-window anti-contamination technology to extend maintenance cycles and stabilize laser energy transmission
Large-area deposition and high-throughput expansion modules, scaling from R&D to small-batch production
Epitaxial growth of atomically flat single-crystal thin films across complex oxides, nitrides, and ceramics
UHVTo 1100°CEpitaxial growth
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MSMagnetron Sputtering

Magnetron Sputtering System

High-uniformity co-sputtering for research film stacks

A UHV magnetron sputtering platform built for repeatable, high-uniformity multi-element thin-film deposition.

Ultra-high vacuum system
UHV-compatible target guns with full-auto tilt adjustment without breaking vacuum, repeat positioning accuracy of 0.1°
Auto-focus target guns improve co-sputtering composition uniformity and process flexibility
Quick-open doors and anti-contamination shielding for easy cleaning and reduced particle count
Fully automatic load-lock transfer for wafer/substrate handling, reducing manual intervention
Multi-module vacuum cluster compatibility for metals, alloys, ceramics, and oxides in one integrated process
UHVCo-sputteringAuto load-lock
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EBEE-Beam Evaporation

Electron Beam Evaporation System

Precision thermal and ion-beam-assisted deposition

A resistive/radiative-heating evaporation system for precision research coatings, compatible with PLD and magnetron vacuum integration.

Resistive/radiative heating sample stage (inert gas and oxygen compatible), with integrated resistive heating and liquid-nitrogen cooling
Quick-open door and anti-contamination shielding for easy maintenance
Fully automated coating process control
Sample stage with rotation, lift, translation, and tilt; compatible with load-lock and glove-box integration
Can integrate thermal evaporation and ion-beam-assisted deposition
UHV compatible
UHVIon-beam assistGlove-box ready
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VCTVacuum Interconnect

Vacuum Cluster Tool System

In-situ multi-process integration platform

A vacuum interconnect platform that links deposition and characterization tools in situ, keeping samples under vacuum across the full process flow.

Ultra-high vacuum design with dual-mode heating from room temperature to 1100°C
Versatile sample-holder designs compatible with multiple deposition and testing tools for seamless transfer between processes
Sample stage rotation, lift, translation, and tilt, with efficient interlock to load-locks and glove boxes
In-situ vacuum interconnection between deposition systems, keeping samples free of atmospheric exposure across multiple coating steps
Interconnects with vacuum characterization tools (XPS, AES, scanning probe microscopy) for real-time surface analysis without breaking vacuum
Compatible with linear or radial/cluster transfer systems for highly automated multi-station production lines
In-situ transferXPS / AES linkCluster or linear
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R&DCombinatorial Sputtering

High-Throughput Materials Preparation System

For advanced R&D and process validation

Built for advanced research and development and process validation of sputtered thin films, enabling rapid materials screening.

Prepares up to 100 samples simultaneously with high-speed batch testing
Film thickness uniformity (1σ) on 4-inch samples better than 1%
Compatible with multiple deposition techniques, supports growth of a wide range of thin-film materials
100 samples1σ < 1% on 4″Multi-technique
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Discuss Your Equipment Requirements

Share your process specifications and our engineering team can advise on system configuration and expected performance.

Request Equipment Specifications Talk to Our Engineering Team